AD±±70
ABSOLUTE MAXIMUM RATINGS
TA = ꢀ5°C, unless otherwise noted.
Table 4.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
Parameter
Rating
VDD to AGND, AGNDS, DGND
VSS to AGND, AGNDS, DGND
AGND, AGNDS to DGND
REFGND to AGND, ADNDS
REFIN to AGND, AGNDS
REFIN to REFGND
Digital Inputs to DGND
VOUT to AGND, AGNDS
SDO to DGND
−0.3 V, +1± V
+0.3 V, −1± V
−0.3 V to +0.3 V
VSS − 0.3 V to VDD + 0.3 V
VSS − 0.3 V to VDD + 0.3 V
−0.3 V to +1± V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to +6.5 V
−40°C to +125°C
−40°C to +125°C
−40°C to +ꢁ5°C
−65°C to +150°C
Operating Temperature Range:
W, Y Grades
A, B Grades
Storage Temperature Range
Maximum Junction Temperature
(TJ Max)
150°C
16-Lead SSOP Package
Power Dissipation
θJA Thermal Impedance
Lead Temperature (Soldering 10 s)
IR Reflow, Peak Temperature
(TJ max – TA)/θJA
13ꢀ°C/W
300°C
230°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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