ADV7390/ADV7391/ADV7392/ADV7393
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 10.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter1
Rating
VAA to AGND
VDD to DGND
PVDD to PGND
VDD_IO to GND_IO
VAA to VDD
VDD to PVDD
VDD_IO to VDD
AGND to DGND
AGND to PGND
AGND to GND_IO
DGND to PGND
DGND to GND_IO
PGND to GND_IO
Digital Input Voltage to GND_IO
Analog Outputs to AGND
Storage Temperature Range (tS)
Junction Temperature (tJ)
Lead Temperature (Soldering, 10 sec)
−0.3 V to +3.9 V
−0.3 V to +2.3 V
−0.3 V to +2.3 V
−0.3 V to +3.9 V
−0.3 V to +2.2 V
−0.3 V to +0.3 V
−0.3 V to +2.2 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to VDD_IO + 0.3 V
−0.3 V to VAA
Table 11. Thermal Resistance1
Package Type
32-Lead LFCP
40-Lead LFCSP
2
θJA
27
26
θJC
32
32
Unit
°C/W
°C/W
1 Values are based on a JEDEC 4 layer test board.
2 With the exposed metal paddle on the underside of the LFCSP soldered to
the PCB ground.
The ADV739x is a Pb-free product. The lead finish is 100% pure
Sn electroplate. The device is RoHS compliant, suitable for Pb-
free applications up to 255°C ( 5°C) IR reflow (JEDEC STD-20).
The ADV739x is backward-compatible with conventional SnPb
soldering processes. The electroplated Sn coating can be
soldered with SnPb solder pastes at conventional reflow
temperatures of 220°C to 235°C.
−60°C to +100°C
150°C
260°C
ESD CAUTION
1 Analog output short circuit to any power supply or common can be of an
indefinite duration.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 15 of 96
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