Data Sheet
ADuC7019/20/21/22/24/25/26/27/28/29
OUTLINE DIMENSIONS
6.10
6.00 SQ
5.90
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
31
30
40
1
5.85
5.75 SQ
5.65
0.50
BSC
PIN 1
INDICATOR
4.25
4.10 SQ
3.95
EXPOSED
PAD
(BOTTOM VIEW)
10
11
21
20
0.50
0.40
0.30
0.20 MIN
TOP VIEW
4.50 REF
0.80 MAX
0.65 TYP
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
12° MAX
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.20 REF
0.30
0.23
0.18
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 96. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-1)
Dimensions shown in millimeters
6.10
6.00 SQ
5.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
INDICATOR
31
30
40
1
0.50
BSC
4.25
4.10 SQ
3.95
EXPOSED
PAD
21
20
10
11
0.45
0.40
0.35
0.25 MIN
TOP VIEW
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD.
Figure 97. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
6 x 6 mm Body, Very Very Thin Quad
(CP-40-9)
Dimensions shown in millimeters
Rev. F | Page 97 of 104