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ADSYS8401JPCZ 参数 Datasheet PDF下载

ADSYS8401JPCZ图片预览
型号: ADSYS8401JPCZ
PDF下载: 下载PDF文件 查看货源
内容描述: LCD电平转换器与VCOM , NRS缓冲器和高压边缘检测 [LCD Level Shifters with VCOM, NRS Buffers, and High Voltage Edge Detector]
分类和应用: 转换器电平转换器高压
文件页数/大小: 16 页 / 297 K
品牌: ADI [ ADI ]
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ADSY8401  
ABSOLUTE MAXIMUM RATINGS  
Table 2.  
Parameters  
Supply Voltages  
AVCC to AGND  
AVCCL to AGNDL  
AGND to AGNDL  
AGND to DGND  
DVCC to DGND  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only and functional operation of the device at these or  
any other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Rating  
18 V  
18 V  
0.5 V  
0.5 V  
4.5 V  
MAXIMUM POWER DISSIPATION  
Input Voltages  
Junction Temperature  
Maximum Digital Input Voltages  
Minimum Digital Input Voltages  
Maximum Analog Input Voltages  
Minimum Analog Input Voltages  
Internal Power Dissipation1  
LFCSP Package at 25°C, Ambient  
Operating Temperature Range  
Storage Temperature Range  
Lead Temperature Range (Soldering 10 s)  
DVCC + 0.5 V  
DGND − 0.5 V  
AVCCx + 0.5 V  
AGNDx − 0.5 V  
The maximum power that can be safely dissipated by the  
ADSY8401 is limited by its junction temperature. The  
maximum safe junction temperature for plastic encapsulated  
devices as determined by the glass transition temperature of the  
plastic is approximately 150°C. Exceeding this limit temporarily  
might cause a shift in the parametric performance due to a  
change in the stresses exerted on the die by the package.  
Exceeding a junction temperature of 150°C for an extended  
period can result in device failure.  
3.8 W  
0°C to 85°C  
−65°C to +125°C  
300°C  
1 48-lead LFCSP package:  
θJA = 26°C/W (still air): JEDEC STD, 4-layer PCB, 0 CFM airflow  
θJC = 20°C/W  
Exposed Paddle  
The die paddle must be in good thermal contact with at least a  
partial plane for proper operation in high ambient temperature  
environments. The partial plane must be in good electrical  
contact with AVCC or AGND for reliable electrical operation.  
See the PCB Design for Optimized Thermal Performance  
section for more information on the use of the exposed paddles  
to dissipate excess heat.  
Ψ
Ψ
JB =11.0°C/W (still air)  
JT =0.4°C/W (still air)  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. 0 | Page 6 of 16  
 
 
 
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