ADSP-BF531/ADSP-BF532/ADSP-BF533
A1 BALL PAD CORNER
19.00 BSC
SQ
16.00 BSC
SQ
1.00 BSC
BALL PITCH
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
16 14 12 10 8
6
4
2
17 15 13 11 9
7
5
3
1
TOP VIEW
BOTTOM VIEW
0.40 MIN
2.50
2.23
1.97
SIDE
VIEW
DETAIL A
0.20 MAX
COPLANARITY
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAG-2
.
3. MINIMUM BALL HEIGHT 0.40
0.70
BALL DIAMETER 0.60
0.50
SEATING
PLANE
DETAIL A
Figure 63. 169-Ball Plastic Ball Grid Array (B-169)
SURFACE MOUNT DESIGN
is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat
tern Standard.
Table 40. BGA Data for Use with Surface Mount Design
Package
Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2
Plastic Ball Grid Array (PBGA) B-169
Ball Attach Type
Solder Mask Defined
Solder Mask Defined
Solder Mask Opening
0.40 mm diameter
0.43 mm diameter
Ball Pad Size
0.55 mm diameter
0.56 mm diameter
Rev. E |
Page 58 of 60 |
July 2007
AD [ ANALOG DEVICES ]
