ADSP-BF531/ADSP-BF532/ADSP-BF533
OUTLINE DIMENSIONS
Dimensions in the outline dimension figures are shown in
millimeters.
0.75
0.60
0.45
176
1
0.27
0.22
0.17
PIN 1
26.00
BSC SQ
24.00 BSC SQ
133
132
SEATING
PLANE
0.08 MAX LEAD
COPLANARITY
0.15
0.05
1.45
1.40
1.35
1.60 MAX
DETAIL A
44
45
DETAIL A
0.50 BSC
LEAD PITCH
TOP VIEW (PINS DOWN)
89
88
NOTES
1. DIMENSIONS IN MILLIMETERS
2. ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 OF ITS
IDEAL POSITION, WHEN MEASURED IN THE LATERAL DIRECTION.
3.
CENTER DIMENSIONS ARE NOMINAL
Figure 61. 176-Lead Low Profile Quad Flat Package (LQFP) ST-176-1
12.00 BSC SQ
14 12 10
8
6 4
2
13 11 9
7
5
3 1
A1 CORNER
INDEX AREA
A
B
C
D
E
F
G
H
J
K
L
M
N
P
BALL A1
INDICATOR
10.40
BSC
SQ
TOP VIEW
0.80 BSC
BALL PITCH
1.31
1.21
1.11
BOTTOM VIEW
1.70
MAX
DETAIL A
SEATING
PLANE
0.40 NOM
(NOTE
3)
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MO-205, VARIATION AE WITH EXCEPTION OF
THE BALL DIAMETER.
3.
MINIMUM BALL HEIGHT 0.25.
0.12
0.50
MAX
0.45
COPLANARITY
0.40
BALL DIAMETER
DETAIL A
Figure 62. 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2
Rev. E |
Page 57 of 60 |
July 2007
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