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ADSP-BF532SBST400 参数 Datasheet PDF下载

ADSP-BF532SBST400图片预览
型号: ADSP-BF532SBST400
PDF下载: 下载PDF文件 查看货源
内容描述: Blackfin㈢嵌入式处理器 [Blackfin㈢ Embedded Processor]
分类和应用: 外围集成电路时钟
文件页数/大小: 60 页 / 3447 K
品牌: AD [ ANALOG DEVICES ]
 浏览型号ADSP-BF532SBST400的Datasheet PDF文件第52页浏览型号ADSP-BF532SBST400的Datasheet PDF文件第53页浏览型号ADSP-BF532SBST400的Datasheet PDF文件第54页浏览型号ADSP-BF532SBST400的Datasheet PDF文件第55页浏览型号ADSP-BF532SBST400的Datasheet PDF文件第56页浏览型号ADSP-BF532SBST400的Datasheet PDF文件第57页浏览型号ADSP-BF532SBST400的Datasheet PDF文件第58页浏览型号ADSP-BF532SBST400的Datasheet PDF文件第59页  
ADSP-BF531/ADSP-BF532/ADSP-BF533
Model
ADSP-BF533SBB500
ADSP-BF533SBBZ500
2
ADSP-BF533SBBC500
ADSP-BF533SBBCZ500
2
ADSP-BF533SBBC-5V
ADSP-BF533SBBCZ-5V
2
ADSP-BF533SBBCZ400
2
ADSP-BF533SBST400
ADSP-BF533SBSTZ400
2
ADSP-BF533SKBC-6V
ADSP-BF533SKBCZ-6V
2
ADSP-BF533WBBCZ-5A
2,3
ADSP-BF533WBBZ-5A
2,3
ADSP-BF533WYBCZ-4A
2,3
ADSP-BF533WYBZ-4A
2,3
1
2
Temperature Speed Grade Operating Voltage
Range
1
(Max)
(Nom)
Package Description
–40°C to +85°C 500 MHz
1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 500 MHz
1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +85°C 500 MHz
1.2 V Internal
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 500 MHz
1.2 V Internal
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 533 MHz
1.25 V Internal
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 533 MHz
1.2 V Internal
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.25 V internal,
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
–40°C to +85°C 400 MHz
1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack
(LQFP)
0°C to +70°C
600 MHz
1.3 V Internal
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
0°C to +70°C
600 MHz
1.3 V Internal
160-Ball Chip Scale Package
1.8 V, 2.5 V or 3.3 V I/O
Ball Grid Array (CSP_BGA)
–40°C to +85°C 500 MHz
1.2 V Internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package
Ball Grid Array (CSP_BGA)
–40°C to +85°C 500 MHz
1.2 V Internal, 3.0 V or 3.3 V I/O
169-Ball Plastic Ball Grid Array
(PBGA)
–40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
160-Ball Chip Scale Package
Ball Grid Array (CSP_BGA)
–40°C to +105°C 400 MHz
1.2 V internal, 3.0 V or 3.3 V I/O
169-Ball Plastic Ball Grid Array
(PBGA)
Package
Option
B-169
B-169
BC-160-2
BC-160-2
BC-160-2
BC-160-2
BC-160-2
ST-176-1
ST-176-1
BC-160-2
BC-160-2
BC-160-2
B-169
BC-160-2
B-169
Referenced temperature is ambient temperature.
Z = RoHS Compliant Part.
3
Automotive grade part.
©2007
Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03728-0-7/07(E)
Rev. E |
Page 60 of 60 |
July 2007