ADF4110/ADF4111/ADF4112/ADF4113
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted
Table 3.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only% functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
AVDD to GND1
Rating
−0.3 V to +7 V
−0.3 V to +0.3 V
−0.3 V to +7 V
−0.3 V to +5.5 V
−0.3 V to VDD + 0.3 V
−0.3 V to VP + 0.3 V
−0.3 V to VDD + 0.3 V
320 mV
AVDD to DVDD
VP to GND
VP to AVDD
Digital I/O Voltage to GND
Analog I/O Voltage to GND
REFIN, RFINA, RFINB to GND
RFINA to RFINB
This device is a high performance RF integrated circuit with an
ESD rating of <2 kV, and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
TRANSISTOR COUNT
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Maximum Junction Temperature
TSSOP θJA Thermal Impedance
LFCSP θJA Thermal Impedance
(Paddle Soldered)
−40°C to +85°C
−65°C to +150°C
150°C
150.4°C/W
122°C/W
6425 (CMOS) and 303 (Bipolar).
LFCSP θJA Thermal Impedance
(Paddle Not Soldered)
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
216°C/W
215°C
220°C
1 GND = AGND = DGND = 0 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 6 of 28
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