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ADF4001BRUZ-R7 参数 Datasheet PDF下载

ADF4001BRUZ-R7图片预览
型号: ADF4001BRUZ-R7
PDF下载: 下载PDF文件 查看货源
内容描述: 200 MHz的时钟发生器PLL [200 MHz Clock Generator PLL]
分类和应用: 晶体时钟发生器微控制器和处理器外围集成电路光电二极管信息通信管理
文件页数/大小: 17 页 / 860 K
品牌: ADI [ ADI ]
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ADF4001  
INTERFACING  
ADSP-2181 Interface  
The ADF4001 family has a simple SPI® compatible serial inter-  
face for writing to the device. SCLK, SDATA, and LE control  
the data transfer. When LE (latch enable) goes high, the 24 bits  
that have been clocked into the input register on each rising  
edge of SCLK will be transferred to the appropriate latch. See  
Figure 1 for the Timing Diagram and Table I for the Latch  
Truth Table.  
Figure 12 shows the interface between the ADF4001 family and  
the ADSP-21xx digital signal processor. The ADF4001 family  
needs a 24-bit serial word for each latch write. The easiest way  
to accomplish this using the ADSP-21xx family is to use the  
autobuffered transmit mode of operation with alternate framing.  
This provides a means for transmitting an entire block of serial  
data before an interrupt is generated. Set up the word length for  
8 bits and use three memory locations for each 24-bit word. To  
program each 24-bit latch, store the three 8-bit bytes, enable the  
autobuffered mode, and then write to the transmit register of  
the DSP. This last operation initiates the autobuffer transfer.  
The maximum allowable serial clock rate is 20 MHz. This means  
that the maximum update rate possible for the device is 833 kHz  
or one update every 1.2 ms. This is certainly more than adequate  
for systems with typical lock times in hundreds of microseconds.  
ADuC812 Interface  
ADSP-21xx  
SCLK  
ADF4001  
Figure 11 shows the interface between the ADF4001 family and  
the ADuC812 MicroConverter®. Since the ADuC812 is based  
on an 8051 core, this interface can be used with any 8051-based  
microcontroller. The MicroConverter is set up for SPI master  
mode with CPHA = 0. To initiate the operation, the I/O port  
driving LE is brought low. Each latch of the ADF4001 family  
needs a 24-bit word. This is accomplished by writing three 8-bit  
bytes from the MicroConverter to the device. When the third  
byte has been written, the LE input should be brought high to  
complete the transfer.  
SCLK  
SDATA  
DT  
LE  
CE  
TFS  
I/O FLAGS  
MUXOUT  
(LOCK DETECT)  
On first applying power to the ADF4001 family, it needs three  
writes (one each to the R counter latch, the N counter latch, and  
the initialization latch) for the output to become active.  
Figure 12. ADSP-21xx to ADF4001 Family Interface  
I/O port lines on the ADuC812 are also used to control power-  
down (CE input) and to detect lock (MUXOUT configured as  
lock detect and polled by the port input).  
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE  
The leads on the chip package (CP-20) are rectangular. The  
printed circuit board pad for these should be 0.1 mm longer  
than the package lead length and 0.05 mm wider than the  
package lead width. The lead should be centered on the pad to  
ensure that the solder joint size is maximized.  
When operating in the mode described, the maximum SCLOCK  
rate of the ADuC812 is 4 MHz. This means that the maxi-  
mum rate at which the output frequency can be changed will  
be 166 kHz.  
The bottom of the chip scale package has a central thermal pad.  
The thermal pad on the printed circuit board should be at least  
as large as this exposed pad. On the printed circuit board, there  
should be a clearance of at least 0.25 mm between the thermal  
pad and the inner edge of the pad pattern. This will ensure that  
shorting is avoided.  
ADuC812  
ADF4001  
SCLK  
SCLOCK  
MOSI  
SDATA  
Thermal vias may be used on the printed circuit board thermal  
pad to improve thermal performance of the package. If vias are  
used, they should be incorporated in the thermal pad at 1.2 mm  
pitch grid. The via diameter should be between 0.3 mm and  
0.33 mm, and the via barrel should be plated with 1 oz. copper  
to plug the via.  
LE  
CE  
I/O PORTS  
MUXOUT  
(LOCK DETECT)  
The user should connect the printed circuit board thermal pad  
to AGND.  
Figure 11. ADuC812 to ADF4001 Family Interface  
B
REV.  
–15–