AD5382
ABSOLUTE MAXIMUM RATINGS
Table 9. TA = 25°C, unless otherwise noted1
Stresses above those listed under Absolute Maximum Ratings
Parameter
Rating
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
–0.3 V to +7 V
DVDD to DGND
–0.3 V to +7 V
Digital Inputs to DGND
SDA/SCL to DGND
–0.3 V to DVDD + 0.3 V
–0.3 V to + 7 V
Digital Outputs to DGND
REFIN/REFOUT to AGND
AGND to DGND
–0.3 V to DVDD + 0.3 V
–0.3 V to AVDD + 0.3 V
–0.3 V to +0.3 V
VOUTx to AGND
–0.3 V to AVDD + 0.3 V
–0.3 V to AVDD + 0.3 V
–0.3 V to AVDD + 0.3 V
–0.3 V to AVDD + 0.3 V
Analog Inputs to AGND
MON_IN Inputs to AGND
MON_OUT to AGND
Operating Temperature Range
Commercial (B Version)
Storage Temperature Range
–40°C to +85°C
–65°C to +150°C
JunctionTemperature (TJ Max) 150°C
100-lead LQFP Package
θJAThermal Impedance
Reflow Soldering
44°C/W
Peak Temperature
230°C
1 Transient currents of up to 100 mA will not cause SCR latch-up
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 13 of 40
ADI [ ADI ]
