ACT5880
Rev 2, 03-Sep-13
ABSOLUTE MAXIMUM RATINGSc
PARAMETER
CHGIN to GA (Continuous)
VALUE
UNIT
7
6
BATID, TH, ACIN, HFPWR, VSYS and nSTAT to GA
ODO1 to GLED
42
5
ODO2, ODO3 to GLED
ON6, ON9, REFBP, BBCIN, VALIVE, VBBAT, XTAL-, XTAL+, CLK32, VSEL,
VBAT, CHGLEV, SDA, SCL, PWRHLD, nIRQ, nRSTO, nPBSTAT, nPBIN, OUT1
and OUT2 to GA
6
XPOS, XNEG, YPOS, YNEG, AUX0, AUX1, AUX2, VD to GD
6
SW1 to GP1
-0.3 to (VP1 + 0.3)
-0.3 to (VP2 + 0.3)
42
V
SW2 to GP2
OUT3, SW3, FB3 to any GP3
OUT6 to GA
-0.3 to (INL6 + 0.3)
-0.3 to (INL7 + 0.3)
-0.3 to (INL89 + 0.3)
-0.3 to (INL1011 + 0.3)
-0.3 to (INL1213 + 0.3)
OUT7 to GA
OUT8, OUT9 to GA
OUT10, OUT11 to GA
OUT12, OUT13 to GA
Difference between any two ground groups: GP1, GP2, GP3, GLED, GD, GA
Junction to Ambient Thermal Resistance (θJA)
Power Dissipation, TA=25 ˚C
-0.3 to + 0.3
43
°C/W
W
2
Power Dissipation Degrading for TA>25 ˚C
Operating Junction Temperature (TJ)
25
mW/°C
-40 to 150
-40 to 85
-55 to 150
300
Operating Ambient Temperature range (TA)
Storage Temperature
°C
Lead Temperature (soldering for 10 sec.)
c: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may
affect device reliability. Functional operation at conditions other than the operation conditions specified is not implied. Only one absolute
maximum rating should be applied at any time.
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