Device Architecture
Table 2-46 • Analog Channel Specifications (continued)
All Values at Industrial Operating Conditions (unless noted otherwise)
Typical: VCC33A = 3.3 V, VCC = 1.5 V, and TA = 25°C
Parameter
Description
Condition
Minimum Typical Maximum Units
Temperature Monitor Using Analog Pad AT
External
Temperature
Monitor4
(using
external
diode
Resolution
8-bit ADC
10-bit ADC
12-bit ADC
4
1
1
5
3
°C
°C
°C
ꢀC
°C
Offset 5
Accuracy
2N3904)
External Sensor
Source Current
High level
10
µA
Low level
8-bit ADC
10-bit ADC
12-bit ADC
100
4
µA
°C
°C
°C
ꢀC
°C
µs
µs
µs
Internal
Temperature
Monitor
Resolution
1
1
Offset 5
5
Accuracy
3
tTMSHI
tTMSLO
tTMSSET
Temperature
Monitor Strobe
High time
Low time
10
5
105
Setting time
5
Analog Input as a Digital Input
2, 3
VIND
Input Voltage
Hysteresis
Refer to Table 3-2 on page 3-3.
VHYSDIN
VIHDIN
VILDIN
0.3
1.2
0.9
V
V
Input HIGH
Input LOW
V
VMPWDIN
Minimum Pulse
Width
50
ns
FDIN
Maximum Frequency
10
MHz
µA
ISTBDIN
Input Leakage
Current
2
IDYNDIN
tINDIN
Dynamic Current
Input Delay
20
10
µA
ns
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad.
There is no reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. Measurement is done by forcing a temperature on an external diode, with the Fusion device at room
temperature.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be
used, based on voltage on the pad.
2-116
Preliminary v1.7
ACTEL [ Actel Corporation ]
