A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
A.3 REQUIREMENTS.
A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-
PRF-389535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The
Modification in the QM plan shall not effect the form, fit or function as described herein.
A.3.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as specified
in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein.
A.3.2.1 Die physical dimensions. The die physical dimensions shall be specified in A.1.2.5.1 and on figures A-1, A-2, A-3,
and A-4.
A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as
specified in A.1.2.5.2 and on figures A-1, A-2, A-3, and A-4.
A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.5.3 and on figures A-1, A-2, A-
3, and A-4.
A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.5.4 and figures A-1,
A-2, A-3, and A-4.
A.3.2.5 Truth table(s). Where technically applicable, (for die) the truth table(s) shall be as defined within paragraph 3.2.3 of
the body of this document.
A.3.2.6 Radiation exposure circuit. The radiation exposure circuit will be as specified on figure 4 as shown within the body of
this document.
A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table IA of the body of this
document.
A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
sufficient to make the packaged die capable of meeting the electrical performance requirements in table IA.
A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN
listed in 10.2 herein. The certification mark shall be “QML” or “Q” as required by MIL-PRF-38535.
A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-
38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of
compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the
manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535.
A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
shall be provided with each lot of microcircuit die delivered to this drawing.
A.3.8 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result
in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item
drawing.
A.3.8.1 Unprogrammed die delivered to the user. All testing shall be verified through wafer probe test as defined in A.4.2.
A.3.8.2 Manufacturer-programmed die delivered to the user. The programming integrity test shall be performed during
programming. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
SIZE
STANDARD
5962-92156
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
J
SHEET
22
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
