Appendix A
Appendix A forms a part of SMD 5962-92156
A.1 Scope
A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers
approved QML plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices
using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes
consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or
Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.
A.1.2 PIN. The PIN is as shown in the following example:
5962
|
|
F
|
|
92156
01
|
|
Q
|
|
9
|
|
X
|
|
Federal
stock class
designator
RHA
designator
(10.2.1)
Device
type
(see 10.2.2)
Device
class
(see 10.2.3)
Die
Code
(see 10.2.4)
Die
details
(see 10.2.5)
\___________ __________/
V
Drawing number
A.1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
A.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
Bin speed
01
03
04
1280A
RH1280
1280XL
8000 gate, field programmable gate array
8000 gate, field programmable gate array
8000 gate, field programmable gate array
200 ns
160 ns
120 ns
A.1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level
as follows:
Device class
Q or V
Device requirements documentation
Certification and qualification to MIL-PRF-38535
A.1.2.4 Die code. The die code designator shall be a number 9 for all devices supplied as die only with no case outline.
A.1.2.5 Die details. The die details designation shall be a unique letter which designates the die’s physical dimensions,
bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each
product and variant supplied to this appendix.
A.1.2.5.1 Die physical dimensions.
Device type
Die size
Die thickness
Die Detail
Figure Number
01
01
03
04
421mils X 437mils
421mils X 437mils
365 mils X 385 mils
286 mils X 299 mils
15±1 mils
16±1 mils
25±1 mils
19±1 mils
A
B
C
D
A-1
A-2
A-3
A-4
SIZE
STANDARD
5962-92156
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
J
SHEET
20
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
