A.1.2.5.2 Die bonding pad locations and electrical functions.
Device type
Die Detail
Figure Number
01
01
03
04
A
B
C
D
A-1
A-2
A-3
A-4
A.1.2.5.3 Interface materials.
Device type
Top metalization
Backside metalization
Die Detail
Figure Number
01
01
03
04
Ti-cap+Al/Cu/Si,9-12k
TiW+Al/Cu,9-12k
Ti-cap+Al/Cu/Si,9-12k
Ti-cap+Al/Cu/Si,9-12k
None (backgrind)
None (backgrind)
None (backgrind)
None (backgrind)
A
B
C
D
A-1
A-2
A-3
A-4
A.1.2.5.4 Assembly related information.
Device type
Glassivation
Die Detail
Figure Number
01
01
03
04
Ox/Nitride
Ox/Nitride
Ox/Nitride
Ox/Nitride
A
B
C
D
A-1
A-2
A-3
A-4
A.1.2.5.5 Wafer fabrication source.
Device type
Source
Die Detail
Figure Number
01
01
03
04
Matsushita Electronics Corp. Japan
Texas Instrument, Texas
Lockheed Martin Federal System, VA
Chartered Semiconductor, Singapore
A
B
C
D
A-1
A-2
A-3
A-4
A.1.3 Absolute maximum ratings.
See paragraph 1.3 within the body of this drawing for details.
A.1.4 Recommended operating conditions.
See paragraph 1.4 within the body of this drawing for details.
A.2 APPLICABLE DOCUMENTS.
A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARD
MIL-STD-883 - Test Method Standard Microcircuits.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
SIZE
STANDARD
5962-92156
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
J
SHEET
21
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
