MIL-PRF-38535K
APPENDIX H
H.3.4.5 Technology qualification report approval . The technology qualification report that demonstrates successful
compliance to the qualification test plan, and shall be submitted to the QA for their review and approval.
H.3.4.6 Qualification test report. The manufacturer should present to the qualifying activity (QA) an analysis of the
qualification data. The aim of this analysis is to show that all process variables are under control and repeatable within the
certified technology and that parametric monitor, TCV, and SEC data monitoring are adequate and correlatable to the process.
The QA should be notified of any improvements/changes to the certified QML technology flow as a result of evaluating the
qualification testing data. The following data, if applicable, should be addressed and retained by the manufacturer to support the
results:
a. Simulation results from the design process (can be reviewed during the validation).
b. Parametric monitor test data.
c. Results of each subgroup test conducted, both initial and any resubmissions.
d. Number of devices tested and rejected.
e. Failure mode and mechanism for each rejected device.
f. Read and record variable data on all specified electrical parameter measurements.
NOTE: Specified electrical tests from a serialized, random sample (minimum of 22 devices) may be used to satisfy this
requirement. The manufacturer may submit variables data in histogram format giving mean and standard deviation or
equivalent for passing microcircuits.
g. Where delta limits are specified, variable data, identified to the microcircuit serial number, should be provided for initial
and final measurements.
h. For physical dimensions, the actual dimension measurements on three randomly selected microcircuits, except where
verification of dimensions by calibrated gauges, overlays, or other comparative dimensions verification devices is
allowed.
i. For bond strength testing, the forces at the time of failure and the failure category, or the minimum and maximum
readings of the microcircuits if no failures occur.
j. For die shear or stud pull strength testing, the forces at the time of the failure and the failure category, or the die shear
or stud pull reading if no separation occurs.
k. A copy of the test data on nondestructive bond pull testing as required by TM 2023 of MIL-STD-883.
l. For RHA testing, pre-test and post-test end-point electrical parameters, transient and single event phenomenon (SEP)
response and test conditions (if applicable).
m. For lid torque strength testing, the forces at the time of failure or the actual torque, if no separation occurs.
n. For internal water vapor content readings, report all gases found.
o. Copy of burn-in circuits.
H.3.4.7 Qualification test failures. If any particular testing results are not successful, the manufacturer should perform
failure analysis and take necessary corrective action. The manufacturer should notify the qualifying activity of any decision not
to pursue qualification of any material or manufacturing construction technique previously certified. After corrective actions
have been implemented, qualification testing should restart.
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ACTEL [ Actel Corporation ]
