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5962-9958502QXC 参数 Datasheet PDF下载

5962-9958502QXC图片预览
型号: 5962-9958502QXC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 36000 Gates, 2414-Cell, CMOS, CQFP256, CERAMIC, QFP-256]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX H  
TABLE H-IIB. Technology characterization testing for plastic packages .  
Group  
number  
MIL-STD-883 test method  
or industry standard  
Process  
Dimensions  
Test  
1
2
Physical dimension  
TM 2016 1/  
Resistance to moisture  
a. Preconditioning Electrical test  
a. In accordance with device specification.  
2/  
b. Biased HAST  
b. JESD22-A110 3/  
(500 hours, +130°C , 85% RH)  
c. In accordance with device specification.  
c. End-point electricals test  
Salt atmosphere  
3
4
Susceptibility to corrosion  
TM 1009  
Susceptibility to leakage and  
corrosion  
Autoclave (no bias)  
(pressure pot) 2 atm., +121°C  
JESD22-A102  
(data to be provided for 96 hours and  
168 hours)  
5
6
Leads  
Lead integrity  
TM 2004, condition A, B2 or D  
a. 168 hours at +85°C/85% RH or bake +  
minimum guaranteed time at  
+30°C /60% RH  
b. Vapor phase (+219°C , no preheat) or  
Infrared (+240°C maximum)  
c. Cross-section at 1000X, ultrasonic  
(C-SAM) etc. TM 2030  
Susceptibility to moisture  
induced cracking at reflow  
soldering for surface mount  
and applicable through hole  
packages  
a. Moisture intake  
b. Reflow simulation  
c. Inspection for Delamination  
and cracks  
7
8
Safety  
Flammability  
ASTM G21  
UL 94, ASTM D2863  
Fungus resistance  
Required only if fungus is a concern  
9
Susceptibility to electrostatic  
discharge (ESD) sensitivity  
ESD  
TM 3015 or JESD22-A114 4/  
JESD78 or manufacturers internal  
procedures  
Susceptibility to latch-up  
Thermal resistance  
Latch-up test  
10  
11  
Thermal characteristics  
TM 1012  
1/ Performed as either characterization or as part of qualification.  
2/ The manufacturer shall define a "preconditioning" procedure that simulates board assembly of plastic surface mount  
devices. This procedure should include moisture intake and reflow simulation. Exposure to soldering fluxes (possible  
source of corrosiveness) and to board cleaning agents is also recommended for preconditioning the devices.  
3/ Five hundred hours of highly accelerated stress testing (HAST) is preferred but the qualifying activity shall consider the  
manufacturers overall processing and testing to evaluate this requirement. The actual HAST hours or alternate testing  
shall be included in the QM plan.  
4/ ESD classification level is as defined within test method 3015.  
175  
 
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