MIL-PRF-38535K
APPENDIX H
TABLE H-IIA. Technology characterization testing for hermetic and non-hermetic packages .
MIL-STD-883 test method and condition or JEDEC test method
Process
Group
number
Hermetic packages
Non-hermetic packages
1
2
Dimension
1/
Physical dimension TM 2016
Physical dimension TM 2016
Where applicable
a. Thermal shocks TM 1011,
condition C, 15 cycles
Where applicable
a. Thermal shocks TM 1011,
condition C, 15 cycles
Resistance to moisture
b. Temperature cycles TM 1010,
condition C, 100 cycles
b. Temperature cycles TM 1010,
condition C, 100 cycles
c. Moisture resistance TM 1004,
unbiased condition
c. HAST(Biased) JESD22-A110
d. Visual inspection TM 1010 and
TM 1004 visual criteria
d. Visual inspection TM 1010 and
TM 1004 visual criteria
e. Fine and gross leak TM 1014
e. Not applicable
Where applicable
Salt atmosphere TM 1009,
condition A
Where applicable
Salt atmosphere TM 1009,
condition A
3
4
Susceptibility to corrosion
Leads
Where applicable
Where applicable
Lead integrity TM 2004,
condition A, B2 or D
Lead integrity TM 2004,
condition A, B2 or D
For pin grid array TM 2028
For pin grid array TM 2028
For BGA (ball shear) - JESD22-B117
For CGA (Column pull test) TM 2038
For BGA (ball shear) - JESD22-B117
For CGA (Column pull test) TM 2038
5
6
Susceptibility to electrostatic
discharge (ESD) sensitivity 2/
ESD TM 3015 or JESD 22-A114
ESD TM 3015 or JESD 22-A114
Where applicable
Latch-up test JESD78 or
Manufacturers internal procedures
Where applicable
Latch-up test JESD78 or
Manufacturers internal procedures
Susceptibility to latch-up
7
8
Thermal resistance
Thermal characteristics
TM 1012
Thermal characteristics
TM 1012
TM 5011 and
Underfill/epoxy materials
TM 5011
For outgassing ASTM E595
Per approved PIDTP
BGA/CGA packages:
Ball/Column attachment
Per approved PIDTP
9
1/ Performed as either characterization or as part of qualification.
2/ ESD classification level is as defined within test method 3015.
174
ACTEL [ Actel Corporation ]
