MIL-PRF-38535K
APPENDIX F
F.4.3.1 Visual examination of bump. Visual examination of the bump is required prior to bond. Sample size and
accept/reject limits shall be documented and determined by the manufacturer, and, at a minimum, address the
following areas:
a. Alignment of bump to pad.
b. Contaminants, conductive residue.
c. Bleeding bump (metallization exposed to higher than normal temperature excursions).
d. Ineffective or improper photoresist application or removal.
e. Cracks, voids.
f. Partial or missing bumps.
g. Nodules or malformed bumps.
h. Discolored bumps.
I. Mechanically damaged bumps.
F.4.4 Bond. Bond requirements shall be as specified in F.4.4.1 through F.4.4.2 inclusive.
F.4.4.1 Bond process characterization. Process characterization of inner lead bond (ILB) is critical to the quality
and reliability of a TAB device and shall be performed and documented to ascertain the minimum, maximum, and
mean destructive bond pull limits to meet the requirements set forth herein. During the process characterization the
following factors shall be considered and included as appropriate:
a. Tape composition.
b. Bond force.
c. Bond temperature.
d. Bond pressure.
e. Underlying layers such as:
(1) Bump configuration.
(2) Glassivation composition.
(3) Bond pad opening.
f. Any underlying metallization and passivation.
g. Cracking (the manufacturer shall evaluate the significance of any cracking throughout the device including
around and below the bump area).
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ACTEL [ Actel Corporation ]
