MIL-PRF-38535K
APPENDIX F
F.3 REQUIREMENTS
F.3.1 Marking. Marking shall be in accordance with the device specification and in an appropriate medium. The
following should be used as guidance: Marking may be in ink, laser marked or etched in the copper of the lead frame
tape. Ink-marking may be performed before or after burn-in. Ink-marked parts shall be subjected to resistance to
solvents (TM 2015 of MIL-STD-883, (see F.4.7.2.1 herein)). In either the ink-marked or tape design case, the
following should be included on each device:
a. On the excised portion of the tape (that portion which remains with the microcircuit):
(1) Name of manufacturer or Commercial and Government Entity (CAGE) code.
(2) Inspection lot date code (determined by the date of final assembly operation, such as date of
encapsulation or date of bonding operation).
b. The following should also be marked on each device, but location may be on the non-excised portion of
the tape, the individual device carrier, or the excised portion of the tape at the manufacturers option:
(1) Part or identifying number (PIN).
(2) Electrostatic discharge (ESD) identifier.
(3) Compliance indicator or certification, whichever is applicable.
(4) Serialization, if applicable.
F.3.2 Process monitors. The applicable process monitors of A.3.4.1.2 shall be performed. The quality assurance
provisions described below within this appendix shall be used to address some of these process monitors.
F.3.3 Lead finish. Lead finish shall be gold, designated a "C", unless otherwise specified in the device
specification.
F.3.4 Item requirements. The individual item requirements for TAB microcircuits delivered under this appendix
shall be documented in the device specification prepared in accordance with 3.5 of this specification.
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ACTEL [ Actel Corporation ]
