MIL-PRF-38535K
APPENDIX F
F.4.7.2.3 Destructive bond strength. Destructive bond strength (TM 2011 of MIL-STD-883) shall be performed,
prior to encapsulation, on inner lead bonds and may be performed during the assembly operation, prior to burn-in.
Sample size shall be in accordance with TM 5005 of MIL-STD-883. The minimum value of destructive bond strength
shall be documented in the device specification. Defect criteria shall include identification of the site of failure at one
or more of the following areas:
a. Lead lift.
b. Lead break at bump.
c. Lead break away from bump.
d. Lead break at tape window.
e. Metal peels off tape.
f.
Bump delamination from thin film metal.
g. Thin film metal delamination.
h. Crater under bump.
i.
j.
Not bonded.
Error (operator, machine, hook slips, etc.).
F.4.7.2.4 Constant acceleration. Constant acceleration (TM 2001 of MIL-STD-883, test condition E (min), Y1
direction only) shall only be required if documented in the device specification.
F.4.7.3 Group C inspection. Group C inspection shall be performed in accordance with TM 1005 of MIL-STD-883.
Sample size shall be in accordance with table IV herein or TM 5005 of MIL-STD-883. Initial group C test shall be
completed utilizing TAB packaging, while subsequent group C inspections may be performed utilizing alternate
packaging technology.
F.4.7.4 Group D inspection. Group D inspection shall be in accordance with TM 5005 of MIL-STD-883 with the
following deletions and additions:
a. Subgroup 1 of table IV shall be performed as specified.
b. Subgroups 2, 6, 7, and 8 of table IV of TM 5005 shall not be performed.
c. Subgroup 3 of table IV of TM 5005 shall be performed as specified with the exception of moisture
resistance (TM 1004) and seal (TM 1014).
d. Subgroup 4 of table IV of TM 5005 shall be performed as specified with the exception of constant
acceleration (unless specified in the device specification) (TM 2001) and seal (TM 1014).
e. Subgroup 5 of table IV of TM 5005 shall be performed as specified with the exception of seal (TM 1014).
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ACTEL [ Actel Corporation ]
