MIL-PRF-38535K
APPENDIX F
F.4 VERIFICATION
F.4.1 General operation flow. The following represents the general operational flow that TAB microcircuits follow.
Reference paragraph
F.4.6.1
F.4.3
Operation
Internal visual (optional)
Bump (100 percent)
F.4.3.1
F.4.4.1
F.4.4.2
F.4.6.2
F.4.5
Bump visual
Bond process characterization (100 percent)
Visual inspection of bond Visual
Internal visual (100 percent)
Encapsulant (optional)
F.4.5.1
F.4.6.3
F.3.1
Encapsulant visual
Temperature cycle (100 percent)
Mark (100 percent)
F.4.6.4
F.4.6.4
F.4.6.4
F.4.6.5
F.4.6.6
F.4.7
Pre burn-in electrical (optional)
Burn-in (100 percent)
Post burn-in electrical (100 percent)
PDA
External visual (100 percent)
Quality conformance inspection
F.4.2 Tape. Procurement of tape shall be baselined by the manufacturer to include the following items F.4.2 a
through F.4.2 f. Items e and f shall be sampled on a frequency basis necessary to demonstrate process control.
a. Design configuration.
b. Tape composition.
c. Coefficient of thermal expansion.
d. Test for delamination of layers.
e. Plating thickness and composition.
f. Dimensions (lead, terminal, external, and window).
F.4.3 Bump. The bump process shall be baselined by the manufacturer to include the following items F.4.3a
through F.4.3j. Items F.4.3f through F.4.3j shall be sampled on a frequency basis necessary to demonstrate process
control.
a. Minimum glassivation overlap.
b. Barrier metal system - deposition, composition.
c. Step coverage (bump to glassivation).
d. Design configuration.
e. Thickness of barrier metal.
f. Thickness of bump.
g. Hardness.
h. Bump height uniformity.
i. Bump shear.
j. Bath purity.
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ACTEL [ Actel Corporation ]
