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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
TABLE V. Group D tests (Package related test) . - Continued.  
MIL-STD-883 test method and conditions  
Test  
1/  
Subgroups  
Class Q  
Class V  
Class Y  
(class level B)  
(class level S)  
(class level S)  
Subgroup 8  
sample size 5(0)  
2/  
Lid torque 15/  
Where applicable  
TM 2024  
Where applicable  
TM 2024  
Where applicable  
TM 2024  
Where applicable  
a. TM 2036  
Where applicable  
a. TM 2036  
Where applicable  
a. TM 2036  
Subgroup 9  
sample size 3(0)  
(3 leads minimum)  
16/  
a. Soldering heat  
b. Seal  
b. TM 1014 condition as  
applicable  
b. TM 1014 condition as  
applicable  
b. 5/  
(1) Fine leak  
(2) Gross leak  
c. External Visual  
examination  
c. TM 2009  
c. TM 2009  
c. TM 2009  
d. End-point electrical  
d. As specified in the  
applicable device  
specification  
d. As specified in the  
applicable device  
specification  
d. As specified in the  
applicable device  
specification  
Note: The screening and QCI/TCI tables from MIL-PRF-38535 and MIL-STD-883 Test Methods 5004 and 5005 have been  
combined for consistency. A future revision of MIL-STD-883 will reflect this change as well. Manufacturers shall document in  
their QM plan the screening and QCI/TCI requirements to either MIL-PRF-38535 or MIL-STD-883.  
1/ In-line monitor data may be substituted for subgroups D1, D2, D6, D7, and D8 upon approval by the qualifying activity. The  
monitors shall be performed by package type and to the specified subgroup test method(s). The monitor sample shall be taken at  
a point where no further parameter change occurs, using a sample size and frequency of equal or greater severity than specified  
in the particular subgroup. The in-line monitor data shall be traceable to the specific inspection lot(s) represented (accepted or  
rejected) by the data.  
2/ Electrical reject devices from that same inspection lot may be used for samples. For devices with solder terminations,  
subgroups 1, 2, 5 and 8 tests shall be performed with balls and columns.  
3/ The sample size number of 45, C = 0 for lead integrity shall be based on the number of leads or terminals tested and shall be  
taken from a minimum of 3 devices. All devices required for the lead integrity test shall pass the seal test if applicable (see 4/) in  
order to meet the requirements of subgroup 2. For leaded chip carrier packages, use condition B1. For pin grid array leads and  
rigid leads, use TM 2028. For leadless chip carrier packages only, use test condition D and a sample size number of 15 (C = 0)  
based on the number of pads tested taken from 3 devices minimum. For LGA/BGA/CGA packages, TM 2004 does not apply.  
4/ Seal test (subgroup 2b) need be performed only on packages having leads exiting through a glass seal.  
5/ This test is not applicable for class Y non-hermetic microcircuits devices.  
6/ Devices used in subgroup 3, "Thermal and Moisture Resistance" may be used in subgroup 4, "Mechanical".  
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