MIL-PRF-38535K
6.4.3 Substrate (of a microcircuit or integrated circuit). The supporting material upon, or within which, the elements of a
microcircuit or integrated circuit are fabricated or attached.
6.4.4 Integrated circuit (microcircuit). A small circuit having a high equivalent circuit element density, which is considered
as a single part composed of interconnected elements on or within a single substrate to perform an electronic circuit function.
6.4.4.1 Multichip microcircuit. An integrated circuit or microcircuit consisting of elements formed on or within two or more
semiconductor chips which are separately attached to a substrate or package.
6.4.4.2 Monolithic microcircuit. An integrated circuit or microcircuit consisting exclusively of elements formed in situ on or
within a single semiconductor substrate with at least one of the elements formed within the substrate.
6.4.4.3 Microcircuit module. An integrated circuit, which is an assembly of microcircuits or an assembly of microcircuits and
discrete parts, designed to perform one or more electronic circuit functions, and constructed such that for the purposes of
specification testing, commerce, and maintenance, it is considered indivisible.
6.4.5 Production lot. A production lot of devices manufactured on the same production line(s) (QM technology flow) by
means of the same production technique, materials, controls, and design.
6.4.6 Inspection lot. A quantity of integrated circuits submitted at one time for inspection to determine compliance with the
requirements and acceptance criteria of the applicable device specification. Each inspection lot is to be manufactured on the
same production line through final seal by the same production techniques.
6.4.7 Wafer lot. A wafer lot consists of integrated circuit wafers formed into a lot at the start of wafer fabrication for
homogeneous processing as a group, and assigned a unique identifier or code to provide traceability.
6.4.8 Percent defective allowable (PDA). PDA is the maximum observed percent defective which permits the lot to be
accepted after the specified 100 percent test.
6.4.9 Delta limit. The maximum change in a specified parameter reading that will permit a device to be accepted on the
specified test, based on a comparison of the present measurement with a specified previous measurement.
NOTE: When expressed as a percentage value, it should be calculated as a proportion of the previous measured value.
6.4.10 Rework. Any processing or reprocessing operation documented in accordance with the manufacturer's QM plan,
other than testing, applied to an individual device, or part thereof, and performed subsequent to the prescribed non-repairing
manufacturing operations which are applicable to all devices of that type at that stage.
6.4.11 Final seal. The manufacturing operation that completes the enclosure of a device so that further internal processing
cannot be performed without disassembling the device.
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ACTEL [ Actel Corporation ]
