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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
o. Assembly rework procedure.  
p. Die attach procedures.  
q. Wire/ribbon bonding.  
r. Device traceability and travelers.  
s. Lot formation (wafer, device and inspection).  
t. Assembly area environmental control.  
u. Internal moisture vapor control program.  
v. Electrostatic discharge (ESD) control and testing.  
w. Visual inspection.  
x. Human contamination prevention procedures.  
y. Equipment calibration and maintenance.  
z. Training policy and procedures.  
aa. Electrical test procedures.  
bb. Screening procedure.  
cc. TCI procedures.  
dd. Third party design center procedures.  
ee. Change control procedure.  
ff.  
Chip encapsulation/molding.  
gg. Qualification test plan.  
hh. Characterization procedures.  
ii.  
jj.  
Selection of suppliers.  
New technology/materials evaluation.  
kk. Package integrity demonstration test plan (PIDTP).  
3.4.1.4.1 Package design selection reviews. The manufacturer shall establish and implement systematic package design  
or selection reviews to ascertain compatibility of chip(s) and packages with respect to thermal, electrical and mechanical  
performance and manufacturing, testing, and reliability requirements. Manufacturer’s package element material and finish  
shall be in accordance with A.3.5.6 unless otherwise specified in the manufacturer’s QM plan.  
8
 
 
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