MIL-PRF-38535K
3.4.8.1 Class T radiation requirements. The device specification shall define all the radiation features offered by the QML
manufacturer for the class T device. QML manufacturers supplying class T devices shall meet the requirements of TM 1019 of
MIL-STD-883 and shall document in the QM plan the RHA level specified for the device offered. All devices supplied to this
product class shall be marked with a RHA designator as specified in 3.4.3 herein. Traceability shall be established such that
there is a technical basis for compliance to the specified RHA level designator as marked on the device.
3.5 Device specification. MIL-HDBK-780 details the SMD format to be used (SMD's are to be used except where the
device specification is a MIL-M-38510 device specification or an altered item drawing is required by the device specification or
SMD) and data requirements to be submitted with any device procured under this specification. The QML certification mark
shall not be used until the device specification is approved (see 3.6.3).
3.6 Marking of microcircuits. Marking of QML microcircuits shall be in accordance with the following and the identification
and marking provisions of the device specification or drawing. The marking shall be legible and complete. If any special
marking (e.g., altered item drawing number) is used by the device supplier or user/equipment contractor, it shall be in addition
to the existing/original marking as required herein and shall be visibly separate from and in no way interfere with the marking
required herein. The following shall be placed on each microcircuit:
a. Index point (see 3.6.1).
b. Part or identification number (PIN) (see 3.6.2).
c. Certification mark "Q", or "QML" or “QD”: All Microcircuits acquired to, and meeting the requirements of this
specification and the applicable SMD, device specification, or military temperature range data book parts, which are
approved for supply under QML shall bear the "QML" or "Q" certification mark (see 3.6.3). For diminishing
manufacturing sources (DMS) product using the alternate die/fabrication requirements of A.3.2.2 or other alternatives,
the manufacturer shall use the “QD” certification mark in lieu of the “Q” or “QML” mark (see 3.6.3.1). The certification
marks “Q", or "QML" or “QD” shall be visibly separate and distinct from all other markings on the microcircuits
package.
d. Manufacturer's identification (see 3.6.4).
e. Country of origin (see 3.6.5).
f. Date code (see 3.6.6).
g. Special marking (see 3.6.7).
h. Serialization; when specified by the procuring activity, each microcircuit shall be marked with a unique serial
number assigned within that inspection lot prior to the first recorded electrical measurement in screening.
i. Electrostatic discharge sensitivity identifier, if applicable (see 3.6.7.2).
NOTE: For unpackaged die only items b. through i. shall apply and be marked on the wafer or die carrier and any other
container external to the wafer or die carrier. For tape automated bonded (TAB) (see appendix F) device marking shall be as
defined in the procurement document.
3.6.1 Index point. The index point, tab, or other marking indicating the starting point for numbering of leads or for
mechanical orientation shall be as specified in the device specification and shall be designed so that it is visible from above
when the microcircuit is installed in its normal mounting configuration. The outline, or solid equilateral triangle(s), which are
used as an electrostatic identifier (see 3.6.7.2), may also be used as the pin 1 identifier.
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ACTEL [ Actel Corporation ]
