MIL-PRF-38535K
3.4.1.2 Management and technology validation. The validation by the QA shall include, as a minimum, the following
applicable areas of each of the manufacturer's facilities including second and third party facilities: Management quality
assurance, design, mask, wafer fabrication, assembly and package, and electrical environmental and radiation test, when
applicable. This validation procedure shall involve a QA review of the manufacturer's QM plan, self-validation and an on-site
visit of the manufacturer's fabrication, assembly, test and other facilities as necessary.
3.4.1.3 On-site validation. Manufacturer shall make available to the QA all data needed to support QM policy and
procedures. QA access to manufacturing (fab and assembly) , testing facilities and operators including offshore shall be
required. For first time QML supplier certification, an on-site QA validation review of the manufacturer's design, wafer
fabrication, assembly, and test facilities shall be required. After the initial qualification is accomplished and with the approval
of the Qualifying Activity, an established manufacturer may add other design, wafer fabrication, assembly, and test facilities
upon completion of the appropriate qualification testing, and a TRB self-assessment and approval. The QA reserves the right
to perform on-site reviews of any facilities/technologies that the manufacturer plans to add to their QML listing. Validation of
third party suppliers is the responsibility of the manufacturer.
3.4.1.3.1 Second and third party validations. A QML certified manufacturer may use second party facilities with the
approval of the QA. A second party facility shall be a QML certified manufacturer facility or a facility that has been granted
approval by the QA for the manufacture or test of QML product. The QA is responsible for the initial and periodic validation of
second party facilities. The process used by the manufacturer’s TRB to initially validate, and to periodically revalidate, a third
party facility shall be reviewed during the initial QML validation process. For third party facilities the QA shall make a
determination whether an onsite certification is required for class level S product. The QA reserves the right to visit third party
facilities to verify that the manufacturer's on-going validation process is effective.
3.4.1.3.2 Radiation source of supply (RSS) validations. An RSS shall receive a QML validation for all processes listed in
this specification and the RSS's program plan. This includes a QML validation of the manufacturing process and laboratory
suitability of the RHA test facilities.
3.4.1.4 Technology validation. The manufacturer's technology flow shall be reviewed and approved by the QA. Some
critical areas which shall be assessed by the QA, as applicable during the validation, are:
a. Design center procedures.
b. Design review procedures.
c. Model verification.
d. Software configuration and configuration management.
e. Testability procedures and policies (e.g., Joint Test Action Group (JTAG)) as applicable.
f. Archival system (e.g., very high speed integrated circuit (VHSIC) hardware description language (VHDL)).
g. Mask validation/inspection procedures.
h. TCV, SEC, PM tests, and data.
i. Fabrication rework procedures.
j. SPC program (all areas).
k. Design rule documentation.
l. Clean room procedures.
m. Wafer traceability.
n. Gallium Arsenide (GaAs) wafer boule evaluation procedure.
7
ACTEL [ Actel Corporation ]
