MIL-PRF-38535K
3.6.2.1 RHA designator. A "- or /" indicates no radiation hardness assurance. Letters M, D, P, L, R, F, G, or H designations
are defined RHA level in (rad(Si)) (see 3.4.3.).
3.6.2.2 Drawing designator. The first two characters of the designator shall consist of the last two digits of the year; the last
three characters shall consist of unique characters assigned to the drawing by DLA Land and Maritime.
3.6.2.2.1 Military designator. The M38510 military designator for microcircuits means a "MIL" specification item produced in
full compliance with this specification including qualification, and the device specification. Any device which does not meet all
the requirements of this specification and the device specification shall not be marked M38510 and shall not make reference to
MIL-PRF-38535.
NOTE: The military designator is optional for leadless chip carrier outlines that have a surface area smaller than the C-10
package.
3.6.2.3 Device class designator. The device class shall be designated by a single letter identifying the quality assurance
level. For example:
Example PIN
under new system
Manufacturing
source listing
Document
listing
Military documentation format
MIL-PRF-38535
SMDs
5962-XXXXXZZ(M, N, Q, V, Y, T (B or S))YY QML-38535
(see 6.4.27 through 6.4.34)
MIL-HDBK-103
MIL-HDBK-103
1.2.1 of MIL-STD-883
SMDs
5962-XXXXXZZ(M)YY
MIL-HDBK-103
(see 6.4.27 through 6.4.33)
3.6.2.4 Case outline. The case outline shall be designated by a single letter assigned to each outline within each device
specification.
3.6.2.5 Lead finish. The lead finish (see A.3.5.6.3.2) shall be designated by a single letter as follows:
Finish letter
Process
A
B
C
D
E
F
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Tin-lead alloy as defined in the applicable device document.
Either A, B, or C (mark on specification only)
X
NOTE: Lead finishes D and E are equivalent, and one may be substituted for the other, at the manufacturer’s option.
3.6.3 Certification mark. All microcircuits acquired to and meeting the requirements of this specification and the applicable
SMD, device specification, or military temperature range data book parts, which are approved for supply under QML, shall
bear the "QML" or "Q" certification mark. The certification marks “Q", or "QML" shall be visibly separate and distinct from all
other markings on microcircuits package.
3.6.3.1 “QD” certification mark. QML manufacturers shall request QA approval for diminishing manufacturing sources
(DMS) product using the alternate die/fabrication requirements of A.3.2.2 or other alternatives. Upon approval the
manufacturer shall use the “QD” certification mark in lieu of the “Q” or “QML” mark. The certification mark “QD” shall be visibly
separate and distinct from all other markings on microcircuits package.
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ACTEL [ Actel Corporation ]
