MIL-PRF-38535K
3.6.3.2 “JAN” or “J” mark. The "J" marking is a legacy certification mark that was required by MIL-M-38510 device
specifications and qualified on a QPL part by part basis. Since the “J” is often mistakenly considered part of the PIN, it may
continue to be marked in front of the military designator portion of the device specification part number at the QML vendor’s
option. This "J" was not and shall not be considered an element of the official part number used to assign a national stock
number.
3.6.4 Manufacturer's identification. Microcircuits shall, as a minimum, identify the manufacturer by the marking of name or
trademark of the manufacturer or the manufacturer may also mark the manufacturer's Commercial and Government Entity
(CAGE) code. The identification of the equipment manufacturer may appear on the microcircuit only if the equipment
manufacturer is also the microcircuit manufacturer. If the microcircuit manufacturer's designating symbol or CAGE code
number is marked, it shall be as assigned by the Defense Logistics Information Service (DLIS). The designating symbol shall
be used only by the manufacturer to whom it has been assigned and only on those devices manufactured at that
manufacturer's plant. In the case of small microcircuits, the manufacturer's designating symbol may be abbreviated by
omitting the first "C" in the series of letters.
3.6.4.1 Code for assembly sites. If the manufacturer has more than one offshore facility for assembly in a given country, a
unique single letter code shall be assigned for the assembly sites used. This code shall be marked on the device immediately
preceding or immediately after the date code. The assembly codes and the full address shall be included in the QML.
3.6.5 Country of origin. The name of the country of assembly or an appropriate abbreviation shall be marked in small
characters below or adjacent to the other marking specified. Backside marking of the country of origin information is
permitted.
3.6.6 Date code. Microcircuits shall be marked with a unique code to identify the first or the last week of the period (6
weeks maximum) during which devices in that inspection lot were sealed. The first two numbers in the code shall be the last
two digits of the number of the year, and the third and fourth numbers shall be two digits indicating the calendar week of the
year.
3.6.7 Marking location and sequence. The QML certification mark, the PIN, the date code, and ESD identifier, if applicable
(see 3.6.7.2), shall be located on the top surface of leadless or leaded chip carriers, pin grid array packages, flat packages or
dual-in-line configurations and on either the top or the side of cylindrical packages (TO configurations and similar
configurations). When the size of a package is insufficient to allow marking of special process identifiers on the top surface,
the backside of the package may be used for these markings except the ESD identifier, if applicable, which shall be marked on
the top. Button cap flat packs with less than or equal to 16 leads may have the identifier marked on the ceramic. Backside
marking with conductive or resistive ink shall be prohibited. For unpackaged die, marking is to be located on the container.
3.6.7.1 Beryllium oxide package identifier. If a microcircuit package contains beryllium oxide, the part shall be marked with
the designation "BeO".
3.6.7.2 Electrostatic discharge (ESD) sensitivity identifier. Individual microcircuit ESD classification marking is not required.
The manufacturer shall have an option of no ESD marking, marking a single ESD triangle or marking in accordance with the
ESD device classification defined in test method (TM) 3015 of MIL-STD-883. Because it may no longer be possible to
determine the ESD classification from the part marking, the Device Discharge Sensitivity classification shall have to be
obtained through MIL-HDBK-103 or QML-38535.
14
ACTEL [ Actel Corporation ]
