MIL-PRF-38535K
APPENDIX C
TABLE C-I. Group E (RHA) TCI/QCI test for class Q, class V and class Y. –continued.
MIL-STD-883 test method and conditions
Minimum sample size quantity (accept no.)
Tests
1/ 2/
Subgroups
Class Q
Class V
Class Y
(class level B)
(class level S)
(class level S)
a. Dose rate upset test
(Transient irradiation test
a. For Digital TM1021
For Linear TM1023
(temperature at 25°C)
2(0) devices/wafer or
11(0) devices/wafer lot
6/
a. For Digital TM1021
For Linear TM1023
(temperature at 25°C)
2(0) devices/wafer or
11(0) devices/wafer lot
6/
a. For Digital TM 1021
For Linear TM1023
(temperature at 25°C)
2(0) devices/wafer or
11(0)devices/inspection lot
5/
Subgroup 3
11/
b. End point electrical
parameters test
b. As specified in
accordance with
device specification
b. As specified in
accordance with
device specification
b. As specified in
accordance with
device specification
Subgroup 4
Radiation dose rate
induced latch-up test
TM 1020
As specified in the
device specification
TM 1020
As specified in the
device specification
TM 1020
As specified in the
device specification
12/
Subgroup 5
Single event effects (SEE)
test
ASTM F-1192 or JESD57
4(0) devices or
As specified in the
device specification
ASTM F-1192 or JESD57
4(0) devices or
As specified in the
device specification
13/
Note: The screening and QCI/TCI tables from MIL-PRF-38535 and MIL-STD-883 Test Methods 5004 and 5005 have been
combined for consistency. A future revision of MIL-STD-883 will reflect this change as well. Manufacturers shall document in
their QM plan the screening and QCI/TCI requirements to either MIL-PRF-38535 or MIL-STD-883.
1/ Group E tests may be performed prior to device screening. Parts used for one subgroup test may not be used for other subgroups
but may be used for higher levels in the same subgroup. End point electrical parameters as specified in accordance with device
specification.
2/ For devices with solder terminations, group E subgroups test may be performed without balls and columns.
3/ The radiation hardness assurance capability level (RHACL)/radiation assurance in the SPEC level is the ratio of the capability level
to the specification level of devices fluence. Subgroups shall be invoked when the radiation hardness assurance capability level
(RHACL) specification requirements of > 10 are not met. For an example, if RHACL/SPEC ratio is > 10 then this test may not be
required, but if the RHACL/SPEC ratio falls within > 1 and ≤ 10 then the subgroup test is required.
4/ This test is to be conducted only when specified in the purchase order or contract. Neutron irradiation test (Displacement damage
test) is not required for MOS devices unless bipolar elements are included by design.
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ACTEL [ Actel Corporation ]
