Case outlines M and T
Case Outline M (1152 LGA)
Dimension (mm)
NOTES:
Symbol
1. All exposed metalized areas and leads are gold plated with 2.5 m
minimum thickness, over 2.0~8.9 m thickness of nickel. For case outline
M, the gold on the bottom side shall be removed prior to solder column
attachment.
2. Lid and Seal ring area are connected to GND.
3. Die attach pad is connected to GND.
4. Case outline M metal pad size is 0.86 0.05 mm
5. Case outline T solder column material is 20/80 Sn/Pb and wrapped with
copper spiral coil. A layer of eutectic solder plated over the surface of the
Cu spiral.
Min.
2.87
2.49
34.65
Nom.
Max.
3.64
A
A2
2.77
35
33.00 BSC
1.00 BSC
3.05
D/E
D1/E1
e
35.35
Case Outline T (1152 CGA)
Dimension (mm)
6. BSC = Basic Spacing between Centers
Symbol
7. Material used for package lid and leads are Fe-Ni-Co alloy.
8. Case outline M has a weight of 16.0 gm, and case outline T has a weight of
20.6 gm.
Min.
4.88
2.01
2.49
0.43
34.65
Nom.
Max.
6.05
2.41
3.05
0.58
35.35
A
A1
A2
2.21
2.77
0.51
b
D/E
D1/E1
e
35
33.00 BSC
1.00 BSC
FIGURE 1. Case outline – Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-04221
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
C
20
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
