Case Outlines Y, Z, and N
Case Outline Y (624 LGA)
Dimension (mm)
Symbol
Min.
2.40
2.02
32.17
Nom.
---
2.3
Max.
3.12
2.53
A
A2
D/E
D1/E1
e
32.50
32.83
30.48 BSC
1.27 BSC
NOTES:
1. All exposed metalized areas and leads are gold plated with
2.5 m minimum thickness on top side and 0.03~0.10 m
on bottom side, over 2.0~8.9 m thickness of nickel.
2. Lid and Seal ring area are connected to GND.
3. Die attach pad is connected to GND.
4. Case outline Y metal pad size is 0.86 0.05 mm
5. Case outline Z solder column material is 10/90 Sn/Pb.
Case outline N solder column material is 20/80 Sn/Pb and wrapped
with copper spiral coil. A layer of eutectic solder plated over the
surface of the Cu spiral.
Case Outline Z and N (624 CGA)
Dimension (mm)
Symbol
Min.
4.41
2.01
2.02
0.43
32.17
Nom.
---
2.21
2.3
0.51
Max.
5.53
2.41
2.53
0.58
32.83
A
A1
A2
b
D/E
D1/E1
e
32.50
30.48 BSC
1.27 BSC
6. BSC = Basic Spacing between Centers
7. Material used for package lid is Fe-Ni-Co alloy
8. Case outline Y has 11.2 gm of weight, and case outline Z and N
have 14.7 gm of weight
FIGURE 1. Case outline – Continued.
SIZE
STANDARD
5962-04221
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
C
19
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
