Case Outline X
Case Outline X (CQ352)
Dimension (mm)
NOTES:
Symbol
Min.
2.43
2.05
0.15
0.1
Nom.
---
2.29
0.2
0.15
Max.
3.11
2.52
0.25
0.2
1. All exposed metalized areas and leads are gold plated
with 2.5 m minimum thickness over 2.0~8.9 m thickness
of nickel.
2. Lid and Seal ring area are connected to GND.
3. Die attach pad is connected to GND.
4. Tie-bar dimensions are for reference only.
5. BSC = Basic Spacing between Centers
6. Material used for package lid and leads are Fe-Ni-Co alloy.
7. Case outline X has 24.0 gm weight, which is measured after
tie-bar removed.
A
A1
b
c
D1/E1
D2/E2
e
H
K
L1
47.75
48
48.25
43.5 BSC
0.5 BSC
70 BSC
65.9 BSC
75
74.6
75.4
FIGURE 1. Case outline
SIZE
STANDARD
5962-04221
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
C
18
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
