HSOP-8A Test Board
Board D
(4)
IC Mount Area
Item
Specification
Size [mm]
Material
Number of copper foil layer
1
114.3 x 76.2 x t1.6
FR-4
4
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
2
Copper foil layer [mm]
3
4
Thermal via
Board E
(5)
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
Number of copper foil layer
1
FR-4
4
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
2
Copper foil layer [mm]
3
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
4
Number: 4
Diameter: 0.3 mm
Thermal via
enlarged view
No. HSOP8A-A-Board-SD-1.0
ABLIC Inc.
ABLIC [ ABLIC ]
