TO-252-5S Test Board
Board A
Board B
Board C
(1)
(2)
(3)
IC Mount Area
Item
Specification
Size [mm]
Material
114.3 x 76.2 x t1.6
FR-4
2
Number of copper foil layer
Land pattern and wiring for testing: t0.070
1
-
2
3
4
Copper foil layer [mm]
Thermal via
-
74.2 x 74.2 x t0.070
-
Item
Size [mm]
Specification
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
1
2
3
4
Copper foil layer [mm]
Thermal via
Item
Size [mm]
Specification
114.3 x 76.2 x t1.6
FR-4
Material
Number of copper foil layer
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
1
2
3
4
Copper foil layer [mm]
Thermal via
Number: 4
Diameter: 0.3 mm
No. TO252-5S-A-Board-SD-1.0
enlarged view
ABLIC Inc.
ABLIC [ ABLIC ]
