SOT-89-5 Test Board
IC Mount Area
Board A
Board B
Board D
(1)
(2)
(3)
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
Copper foil layer [mm]
2
1
2
3
4
Land pattern and wiring for testing: t0.070
-
-
74.2 x 74.2 x t0.070
-
Thermal via
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
Copper foil layer [mm]
4
1
2
3
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
Thermal via
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
4
Number of copper foil layer
Copper foil layer [mm]
Pattern for heat radiation: 2000mm2 t0.070
1
2
3
4
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
Thermal via
Board E
(4)
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
Copper foil layer [mm]
4
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
1
2
3
4
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
Thermal via
No. SOT895-A-Board-SD-1.0
enlarged view
ABLIC Inc.
ABLIC [ ABLIC ]
