HTMSOP-8 Test Board
IC Mount Area
Board D
(4)
Item
Specification
Size [mm]
Material
114.3 x 76.2 x t1.6
FR-4
Number of copper foil layer
4
Pattern for heat radiation: 2000mm2 t0.070
1
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
2
3
4
Copper foil layer [mm]
Thermal via
enlarged view
Board E
(5)
Item
Size [mm]
Specification
114.3 x 76.2 x t1.6
Material
FR-4
4
Number of copper foil layer
Pattern for heat radiation: 2000mm2 t0.070
1
74.2 x 74.2 x t0.035
2
3
4
Copper foil layer [mm]
Thermal via
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. HTMSOP8-A-Board-SD-1.0
ABLIC Inc.
ABLIC [ ABLIC ]
