AP2530AGY-HF
P-CH Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
BVDSS
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance2 VGS=-10V, ID=-2A
VGS=0V, ID=-250uA
-30
-
-
-
V
RDS(ON)
-
-
150 mΩ
280 mΩ
V
GS=-4.5V, ID=-1A
-
VGS(th)
gfs
IDSS
IGSS
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Gate-Source Leakage
Total Gate Charge2
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time2
Rise Time
VDS=VGS, ID=-250uA
VDS=-5V, ID=-2A
VDS=-24V, VGS=0V
VGS=+20V, VDS=0V
ID=-2A
-1
-
-
-3
V
2.9
-
-
S
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Ω
-
-1
-
-
+100
Qg
-
2.5
0.8
1.2
5.5
8
4
-
-
-
-
-
-
Qgs
Qgd
td(on)
tr
VDS=-15V
-
VGS=-4.5V
-
VDS=-15V
-
ID=-1A
-
td(off)
tf
Turn-off Delay Time
Fall Time
RG=3.3Ω
-
17
3
VGS=-10V
-
Ciss
Coss
Crss
Rg
Input Capacitance
VGS=0V
-
160 260
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
VDS=-15V
-
60
40
8
-
-
-
f=1.0MHz
-
f=1.0MHz
-
Source-Drain Diode
Symbol
Parameter
Forward On Voltage2
Reverse Recovery Time2
Test Conditions
IS=0.9A, VGS=0V
IS=2A, VGS=0V
Min. Typ. Max. Units
VSD
trr
-
-
-
-
16
9
1.2
V
-
-
ns
nC
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board, t<5sec ; 180℃/W when mounted on min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
3
A-POWER [ ADVANCED POWER ELECTRONICS CORP. ]
