X-band High Power Amplifier
CHA7012
Chip Mechanical Data and Pin references
2
3
4
5
6
7
8
9
10
11
22 21 20
19 18
17
16 15 14
13
Chip thickness = 100µm +/- 10 µm
RF pads (1, 12) = 96 x 196µm²
DC pads (2, 3, 4, 5, 9,15, 19, 20, 21, 22) = 96 x 96µm²
DC pads (7, 17) = 192 x 96µm²
DC pads (11, 13) = 288 x 96µm²
Pin number
Pin name
Description
Input RF
NC
1
8, 16
IN
5, 9, 15, 19
2, 22
Vctrl
TI
Collector current control voltage
TTL input
4, 20
TO
TTL output
6, 10, 14, 18
3, 7, 11, 13, 17, 21
12
GND
V,Vc1,Vc2
OUT
Ground (NC)
Power supply voltage
Output RF
Ref. : DSCHA70129082- 23 March 09
8/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
