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DM512K72DT6-12N 参数 Datasheet PDF下载

DM512K72DT6-12N图片预览
型号: DM512K72DT6-12N
PDF下载: 下载PDF文件 查看货源
内容描述: [Cache DRAM Module, 512KX72, 30ns, MOS, DIMM-168]
分类和应用: 动态存储器内存集成电路
文件页数/大小: 26 页 / 254 K
品牌: RAMTRON [ RAMTRON INTERNATIONAL CORPORATION ]
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refresh bus allows the EDRAM to be refreshed during cache reads.  
Memory writes can be posted as early as 6.5ns after row  
EDRAM Basic Operating Modes  
The EDRAM operating modes are specified in the table.  
enable and are directed to the DRAM array. During a write hit, the  
on-chip address comparator activates a parallel write path to the  
SRAM cache to maintain coherency. Memory writes do not affect  
the contents of the cache row register except during write hits.  
By integrating the SRAM cache as row registers in the DRAM  
array and keeping the on-chip control simple, the EDRAM is able  
to provide superior system performance at less cost, power, and  
area than systems implemented with complex synchronous SRAM  
cache, cache controllers, and multilevel data busses.  
Hit and Miss Terminology  
In this datasheet, “hit” and “miss” always refer to a hit or miss  
to any of the four pages of data contained in the SRAM cache row  
registers. There are four cache row registers, one for each of the  
four banks of DRAM. These registers are specified by the bank  
select row address bits A and A . The contents of these cache row  
9
registers is always equal 8to the last row that was read from each of  
the four internal DRAM banks (as modified by any write hit data).  
Functional Description  
DRAM Read Hit  
The EDRAM is designed to provide optimum memory  
A DRAM read request is initiated by clocking /RE with W/R low  
and /F high. The EDRAM will compare the new row address to the  
last row read address latch for the bank specified by row address  
bits A (LRR: a 9-bit row address latch for each internal DRAM  
bank 8w-9hich is reloaded on each /RE active read miss cycle). If the  
row address matches the LRR, the requested data is already in the  
SRAM cache and no DRAM memory reference is initiated. The data  
specified by the row and column address is available at the output  
pins at the greater of times tAC or tGQV. The /HIT output is driven  
low at time tHV after /RE to indicate the shorter access time to the  
performance with high speed microprocessors. As a result, it is  
possible to perform simultaneous operations to the DRAM and  
SRAM cache sections of the EDRAM. This feature allows the EDRAM  
to hide precharge and refresh operation during reads and  
maximize hit rate by maintaining page cache contents during write  
operations even if data is written to another memory page. These  
capabilities, in conjunction with the faster basic DRAM and cache  
speeds of the EDRAM, minimize processor wait states.  
Four Bank Cache Architecture  
HIT0  
HIT1  
HIT2  
HIT3  
/HIT  
Bank 3  
Bank 2  
Bank 1  
Bank 0  
Last  
Row  
Read  
Address  
Latch  
+ 9-Bit  
Compare  
RA  
0-10  
CA  
0-7  
D0-71  
1M Array  
1M Array  
1M Array  
1M Array  
A
Data-In  
Latch  
0-10  
256 x 72  
Cache  
256 x 72  
Cache  
256 x 72  
Cache  
256 x 72  
Cache  
CA  
0-7  
Bank 0  
Bank 1  
Bank 2  
Bank 3  
(0,0)  
(0,1)  
(1,0)  
(1,1)  
1 of 4 Selector  
RA , RA  
8
9
CAL  
QLE  
Data-Out  
Latch  
G
S
Q0-71  
2-138