Oxford Semiconductor Ltd.
OXFW970 Data Sheet
Pinout &
Package
The device is supplied as a 100-pin TQFP package (14 × 14 × 1 mm).
Figure 2 shows the chip layout.
Information
Figure 2 OXFW970 Pinout
DNC
DNC
VDD1V8
VDD3V3
JTAG_TDI
JTAG_TCLK
JTAG_TMS
DNC
1
75
DNC
DNC
VSS3V3
VDD3V3
DNC
DNC
AUDIO_FS_WORD_CLK
DNC
DNC
VSS3V3
AUDIO_PD_VCO_OUT
VSS1V8
AUDIO_PD_SYS_OUT
VSS1V8
VDD1V8
GPIO_7
GPIO_6
GPIO_5
GPIO_4
DNC
VDD1V8
DNC
OXFW970
DNC
DNC
JTAG_UART_SEL
VDD1V8
VSS1V8
GPIO_3
DNC
GPIO_2
VSS3V3
DNC
GPIO_1
GPIO_0
DNC
VDD3V3
VSS3V3
DNC
DNC
Z_FORCE_FLASH
Z_RESET
DNC
25
51
Table 5 on page 6 details the pin allocations for the device.
DS-0004 Jun 05 (2)
External—Free Release
5