Oxford Semiconductor Ltd.
OXFW970 Data Sheet
Figure 1 OXFW970 Diagram
GPIO
Bit Clock
Word Clock
Data (0)
Data (1)
Data (2)
Data (3)
Serial Audio
ARM
Reference
Peripheral Set
RAM control
Asynch-
ronous
Engine/
Isoch Rx
Engine
FIFO pointers
Fill level
information
1394
1394
Link
Layer
Audio 256-fs Clock Out
Audio 256-fs Clock In
Audio PD VCO Out
Audio PD SYS Out
Unified memory
architecture:
Clock
Recovery
Flash
Memory
APB
Bridge
Queue
Selector
Audio-In
UART
Scratch
RAM
ARM7TMDI
Environmental
Characteristics
Tables 1 to 3 detail the required operating conditions for the device and
the DC electrical characteristics.
Table 1 Absolute Maximum Device Ratings
Symbol
Parameter
Rating
Units
V
V
V
T
DC supply voltage
1.8 V
3.3 V
2.7
3.8
V
DD
DC input voltage
3.3-V input buffer
3.3-V interface/5-V tolerant input buffer
3.8
6.5
V
V
IN
DC output voltage
Storage temperature
3.3-V output buffer
3.3-V interface/5-V tolerant output buffer
3.8
6.5
OUT
Storage temperature
–40 to 85
°C
STG
Table 2 Recommended Operating Conditions
Symbol
Parameter
Rating
Units
V
V
V
T
DC supply voltage for internal
DC supply voltage for I/O block 3.3 V
1.8 V
1.8 ± 0.15
3.3 ± 0.3
V
DD
DC input voltage
3.3-V input buffer
3.3-V interface/5-V tolerant input buffer
3.3 ± 0.3
3.0~5.25
V
IN
DC output voltage
3.3-V output buffer
3.3-V interface/5-V tolerant output buffer
3.3 ± 0.3
3.3 ± 0.3
OUT
Industrial temperature range
–40 to 85
°C
A
DS-0004 Jun 05 (2)
External—Free Release
3
OXFORD [ OXFORD SEMICONDUCTOR ]
