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M11L416256SA-40T 参数 Datasheet PDF下载

M11L416256SA-40T图片预览
型号: M11L416256SA-40T
PDF下载: 下载PDF文件 查看货源
内容描述: [EDO DRAM, 256KX16, 40ns, CMOS, PDSO40, TSOP2-44/40]
分类和应用: 动态存储器光电二极管内存集成电路
文件页数/大小: 16 页 / 230 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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M11L416256A/M11L416256SA  
ABSOLUTE MAXIMUM RATINGS  
Voltage on Any pin Relative to Vss … ……-0.5V to +4.6V  
Permanent device damage may occur if “Absolute  
Maximum Ratings” are exceeded. This is a stress rating  
only, and functional operation of the device above those  
conditions indicated in the operational sections of this  
specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may  
affect reliability.  
A
°
C
to +70°  
Operating Temperature, T (ambient) ….0  
C
Storage Temperature (plastic) ……….-55  
to +150  
°C  
°C  
Power Dissipation …………………………………0.8W  
Short Circuit Output Current ……………………50mA  
DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED  
OPERATING CONDITIONS  
PARAMETER  
A
CC  
(0 ° ≤ T 70 ° ; V = 3.3V ± 10% unless otherwise noted)  
C
C
CONDITIONS  
SYMBOL  
MIN  
3.0  
0
MAX  
3.6  
0
UNITS NOTES  
Supply Voltage  
CC  
V
V
V
1
Supply Voltage  
SS  
IH  
V
CC  
Input High Voltage  
Input Low Voltage  
Input Leakage Current  
V
V
2.0  
-0.3  
-10  
V
+0.3  
V
1
1
IL  
0.8  
10  
V
µ A  
LI  
IN  
IH  
I
0V V V (max)  
0V V  
Output(s) disable  
OUT VCC  
Output Leakage Current  
µ A  
LO  
I
-10  
10  
OH  
OH  
Output High Voltage  
Output Low Voltage  
I
I
= -2 mA  
= 2 mA  
V
2.4  
-
-
V
V
OL  
OL  
V
0.4  
SS  
Note : 1.All Voltages referenced to V  
MAX  
-25 -28 -30 -35 -40  
210 190 170 150 135 mA  
PARAMETER  
CONDITIONS  
SYMBOL  
UNITS NOTES  
CC1  
Operating Current  
I
1,2  
RC  
RAS , CAS cycling , t =min  
IH  
TTL interface , RAS , CAS = V  
,
4
4
4
4
4
mA  
OUT  
D
=High-Z  
CC2  
Standby Current  
I
mA  
CC  
CMOS interface, RAS , CAS V -0.2V  
2
2
2
2
2
RC  
t
= min  
= min  
210 190 170 150 135 mA  
210 190 170 150 135 mA  
2
1,3  
1
RAS only refresh Current  
EDO Page Mode Current  
Standby Current  
CC3  
CC4  
I
I
PC  
t
5
5
5
5
5
mA  
IH  
IL  
RAS =V , CAS = V  
CC5  
CC6  
I
I
CAS BeforeRAS Refresh  
Current  
RC  
t
= min  
210 190 170 150 135 mA  
Battery Backup Current  
(S-ver. only)  
OUT  
RAS , CAS 0.2V, D  
= High-Z,  
µ A  
CC7  
CC8  
I
I
400 400 400 400 400  
CMOS interface  
IL  
RAS = CAS = V ,  
Self Refresh Current  
(S-ver. only)  
µ A  
400 400 400 400 400  
WE  
CC  
= OE = A0~A8 = V -0.2 or 0.2V  
DQ0~DQ15 = V -0.2, 0.2V or open  
CC  
:
CC  
Note 1.I max is specified at the output open condition.  
IL .  
IH  
2. Address can be changed twice or less while RAS =V  
3. Address can be changed once or less while CAS =V  
.
Elite Memory Technology Inc  
Publication Date: Agu. 2001  
Revision : 1.3 3/16