Typical Performance
12
60
50
40
30
20
10
0
Conditions:
TJ ≤ 150 °C
Conditions:
TJ ≤ 150 °C
10
8
6
4
2
0
-55
-30
-5
20
45
70
95
120
145
-55
-30
-5
20
45
70
95
120
145
Case Temperature, TC (°C)
Case Temperature, TC (°C)
Figure 19. Continuous Drain Current Derating vs.
Case Temperature
Figure 20. Maximum Power Dissipation Derating vs.
Case Temperature
10 µs
0.5
0.3
10.00
Limited by RDS On
1
100 µs
1 ms
0.1
100 ms
1.00
0.10
0.01
0.05
100E-3
0.02
Conditions:
TC = 25 °C
D = 0,
0.01
SinglePulse
Parameter: tp
10E-3
0.1
1
10
100
1000
1E-6
10E-6
100E-6
1E-3
Time, tp (s)
10E-3
100E-3
1
Drain-Source Voltage, VDS (V)
Figure 21. Transient Thermal Impedance
(Junction - Case)
Figure 22. Safe Operating Area
300
250
200
150
100
50
180
Conditions:
TJ = 25 °C
Conditions:
TJ = 25 °C
160
140
120
100
80
V
R
V
DD = 600 V
G(ext) = 2.5 Ω
GS = -4V/+15 V
V
R
V
DD = 400 V
G(ext) = 2.5 Ω
GS = -4V/+15 V
FWD = C3M0280090D
L = 220 μH
FWD = C3M0280090D
L = 220 μH
ETotal
ETotal
EOn
EOn
60
40
EOff
20
EOff
12
0
0
0
2
4
6
8
10
14
16
0
2
4
6
8
10
12
14
16
Drain to Source Current,IDS (A)
Drain to Source Current,IDS (A)
Figure 23. Clamped Inductive Switching Energy vs.
Drain Current (VDD = 600V)
Figure 24. Clamped Inductive Switching Energy vs.
Drain Current (VDD = 400V)
6
C3M0280090D Rev. - , 11-2015