Typical Performance
80
70
60
50
40
30
20
10
0
600
500
400
300
200
100
0
Conditions:
TJ ≤ 150 °C
Conditions:
TJ ≤ 150 °C
-55
-30
-5
20
45
70
95
120
145
-55
-30
-5
20
45
70
95
120
145
Case Temperature, TC (°C)
Case Temperature, TC (°C)
Figure 19. Continuous Drain Current Derating vs.
Case Temperature
Figure 20. Maximum Power Dissipation Derating vs.
Case Temperature
100.00
10 µs
Limited by RDS On
100 µs
100E-3
0.5
0.3
1 ms
10.00
100 ms
0.1
0.05
1.00
0.10
0.01
10E-3
1E-3
0.02
SinglePulse
0.01
Conditions:
TC = 25 °C
D = 0,
Parameter:tp
0.1
1
10
100
1000
1E-6
10E-6
100E-6
1E-3
Time, tp (s)
10E-3
100E-3
1
Drain-Source Voltage, VDS (V)
Figure 21. Transient Thermal Impedance
Figure 22. Safe Operating Area
(Junctionꢀ-ꢀCase)ꢀ
1.8
1.5
1.2
0.9
0.6
0.3
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Conditions:
TJ = 25 °C
VDD = 900 V
RG(ext) = 2.5 Ω
VGS = -5V/+20 V
FWD = C2M0045170P
L = 130 μH
Conditions:
TJ = 25 °C
VDD = 1200 V
RG(ext) = 2.5 Ω
VGS = -5V/+20 V
FWD = C2M0045170P
L = 130 μH
ETotal
ETotal
EOn
EOn
EOff
EOff
0.0
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
Drain to Source Current, IDS (A)
Drain to Source Current, IDS (A)
Figure 23. Clamped Inductive Switching Energy vs.
Figure 24. Clamped Inductive Switching Energy vs.
Drain Current (VDDꢀ=ꢀ900V)
Drain Current (VDDꢀ=ꢀ1200V)
6
C2M0045170P Rev. -, 04-2018
CREE [ CREE, INC ]
