ADS5240
www.ti.com
SBAS326C–JUNE 2004–REVISED DECEMBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
SPECIFIED
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE-LEAD
ADS5240IPAP
Tray, 160
ADS5240
HTQFP-64(2)
PAP
-40°C to +85°C
ADS5240I
ADS5240IPAPT Tape and Reel, 1000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
(2) Thermal pad size: 5.29mm × 5.29mm (min), 6.50mm × 6.50mm (max).
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage Range, AVDD
-0.3V to +3.8V
Supply Voltage Range, LVDD
-0.3V to +3.8V
-0.3V to +0.3V
-0.3V to +0.3V
-0.3V to +2.4V
-0.3V to +2.4V
-0.15V to +3.0V
30mA
Voltage Between AVSS and LVSS
Voltage Between AVDD and LVDD
Voltage Applied to External REF Pins
All LVDS Data and Clock Outputs
Analog Input Pins
Peak Total Input Current (all inputs)
Junction Temperature
+105°C
Operating Free-Air Temperature Range, TA
Lead Temperature, 1.6mm (1/16" from case for 10s)
-40°C to +85°C
220°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
2
BB [ BURR-BROWN CORPORATION ]
