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RDA5807 参数 Datasheet PDF下载

RDA5807图片预览
型号: RDA5807
PDF下载: 下载PDF文件 查看货源
内容描述: FM调谐器V1.0 [FM TUNER V1.0]
分类和应用:
文件页数/大小: 21 页 / 815 K
品牌: ETC [ ETC ]
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RDA Microelectronics, Inc.  
RDA5807SP FM Tuner V1.0  
Package Thickness  
Volume mm3  
<350  
Volume mm3  
350  
2.5mm  
2.5mm  
240 + 0/-5 o C  
225 + 0/-5 o C  
225 + 0/-5 o C  
225 + 0/-5 o C  
Table II SnPb Eutectic Process Package Peak Reflow Temperatures  
Package  
Volume mm3  
Volume mm3  
350-2000  
Volume mm3  
Thickness  
350  
2000  
1.6mm  
1.6mm 2.5mm  
2.5mm  
260 + 0 o C *  
260 + 0 o C *  
250 + 0 o C *  
260 + 0 o C *  
250 + 0 o C *  
245 + 0 o C *  
260 + 0 o C *  
245 + 0 o C *  
245 + 0 o C *  
*Tolerance : The device manufacturer/supplier shall assure process compatibility up to and  
including the stated classification temperature(this mean Peak reflow temperature + 0 o C. For  
example 260+ 0 o C ) at the rated MSL Level.  
Table III Pb-free Process Package Classification Reflow Temperatures  
Note 1: All temperature refer topside of the package. Measured on the package body surface.  
o
o
Note 2: The profiling tolerance is + 0  
C, - X  
C (based on machine variation  
capability)whatever  
is required to control the profile process but at no time will it exceed 5 o C. The  
producer assures process compatibility at the peak reflow profile temperatures defined  
in Table III.  
Note 3: Package volume excludes external terminals(balls, bumps, lands, leads) and/or non  
integral heat sinks.  
Note 4: The maximum component temperature reached during reflow depends on package the  
thickness and volume. The use of convection reflow processes reduces the thermal  
gradients between packages. However, thermal gradients due to differences in  
thermal mass of SMD package may sill exist.  
Note 5: Components intended for use in a lead-freeassembly process shall be evaluated  
using the lead freeclassification temperatures and profiles defined in Table-I II III  
whether or not lead free.  
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in  
part without prior written permission of RDA.  
Page 17 of 21  
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