CXA1782CQ/CR
Package Outline
CXA1782CQ
Unit: mm
48PIN QFP (PLASTIC)
15.3 ± 0.4
+ 0.1
0.15 – 0.05
+ 0.4
12.0 – 0.1
36
25
0.15
24
37
+ 0.2
0.1 – 0.1
48
13
1
12
+ 0.15
0.3 – 0.1
0.8
± 0.12
M
+ 0.35
2.2 – 0.15
PACKAGE STRUCTURE
EPOXY RESIN
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
SOLDER / PALLADIUM
PLATING
SONY CODE
EIAJ CODE
QFP-48P-L04
QFP048-P-1212-B
COPPER / 42 ALLOY
0.7g
JEDEC CODE
PACKAGE WEIGHT
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
CXA1782CR
48PIN LQFP (PLASTIC)
9.0 ± 0.2
7.0 ± 0.1
36
25
24
13
37
A
48
(0.22)
12
1
+ 0.05
0.127 – 0.02
0.5 ± 0.08
+ 0.08
+ 0.2
1.5 – 0.1
0.18 – 0.03
0.1
0.1 ± 0.1
0° to 10°
NOTE: Dimension “ ” does not include mold protrusion.
PACKAGE STRUCTURE
DETAIL A
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY / PHENOL RESIN
SOLDER PLATING
SONY CODE
EIAJ CODE
LQFP-48P-L01
QFP048-P-0707-A
42 ALLOY
0.2g
JEDEC CODE
PACKAGE WEIGHT
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 31 –
ETC [ ETC ]
