ZMD31020
Sensor Signal Conditioner
Datasheet
CONTENT
1.
2.
PIN DESCRIPTION......................................................................................................................................3
CIRCUIT DESCRIPTION .............................................................................................................................4
2.1 Signal Flow ....................................................................................................................................................4
2.2 Configuration Word........................................................................................................................................5
2.3
2.4
2.5
Differential Sensor ....................................................................................................................................5
Temperature Sensing ...............................................................................................................................5
Analog Input Channel ...............................................................................................................................6
2.5.1
2.5.2
2.5.3
2.5.4
Bridge Polarity Setting .......................................................................................................................6
Programmable Gain Amplifier PGA...................................................................................................6
Analog-to-digital Converter ADC .......................................................................................................6
Temperature Measurement...............................................................................................................7
2.6
2.7
2.8
2.9
Correction Microcontroller CMC................................................................................................................7
Parameter EEPROM.................................................................................................................................7
Sensor Signal Correction Method and Sequence.....................................................................................8
Digital I2C Interface ...................................................................................................................................8
2.9.1
2.9.2
2.10
Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test.............................8
Data Communication Specifics..........................................................................................................8
The Analog Output Stage....................................................................................................................10
ELECTRICAL SPECIFICATION.................................................................................................................10
Absolute maximum ratings......................................................................................................................10
Operating Conditions ..............................................................................................................................10
Electrical Parameters..............................................................................................................................11
3.
3.1
3.2
3.3
3.3.1
3.3.2
Power Supply...................................................................................................................................11
PGA & 12-bit Input ADC ..................................................................................................................11
Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC (4) ..............................11
12-bit ADC (1) ...................................................................................................................................12
EEPROM programming...................................................................................................................12
Serial I2C Interface...........................................................................................................................12
11-bit Output DAC & Output BUFFER (2).........................................................................................14
Total System....................................................................................................................................14
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
3.3.8
4.
5.
PACKAGE DIMENSIONS ..........................................................................................................................15
DIE DIMENSIONS AND PAD COORDINATES .........................................................................................16
Die Dimensions.......................................................................................................................................16
Pad Coordinates .....................................................................................................................................17
EVALUATION KIT “ZMD31020KIT” ...........................................................................................................18
ORDERING INFORMATION......................................................................................................................19
RELATED DOCUMENTS...........................................................................................................................19
5.1
5.2
6.
7.
8.
Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19
2/19
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD [ Zentrum Mikroelektronik Dresden AG ]
