ZMD31020
Sensor Signal Conditioner
Datasheet
5. DIE DIMENSIONS AND PAD COORDINATES
5.1 Die Dimensions
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Die size (incl. scribeline): 3500µm x 3000µm = 10.5sqmm
Core die size (without scribeline): 3310µm x 2810µm ≈ 9.3sqmm
Die thickness: 390µm
Scribeline (distance between two core dice on wafer): 190µm
Pads size: 90µm x 90µm
14
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10
9
8
2810µm
Core Die
with Pads
ZMD31020
y
0
x
1
2
3
4
5
6
7
725µm
3310µm
Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19
16/19
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD [ Zentrum Mikroelektronik Dresden AG ]
